Subject: [AAA-WG]: Diameter interop testing event (bake off)

From: Tony Johansson <[email-masked]>
Date: Fri, 20 Jul 2001 11:26:40 -0700

All,

Here is the official invitation to the next Diameter interoperability
testing event (bake off).

   * Location: Ericsson Research, 2100 Shattuck Ave, Berkeley,
     California.

   * Date: The first week of October (10/1/01-10/5/01).

   * No Fee, but the registration is binding.

Please find all additional information and how to register at the link
below.

http://standards.ericsson.net/diameter-bake-off

/Tony